Difference Between terms SMT and SMD
Characteristics |
SMT |
SMD |
---|---|---|
Definition |
The method for the assembling electronic components onto the PCBs without inserting leads through holes. |
The individual electronic components designed for the mounting directly onto the PCB surfaces. |
Scope |
The Encompasses the entire process of the assembling components onto PCB surface including placement, inspection and testing. |
The Refers specifically to components that are mounted onto PCB surface using the SMT techniques. |
Process Stages |
Involves component placement solder paste application or reflow soldering and potentially cleaning. |
The Focuses on individual components’ physical design and form such as resistors and integrated circuits. |
Key Importance |
The Methodology for the assembling electronics. |
The Components designed for the direct surface mounting components designed for the direct surface mounting. |
Surface Mount Technology
Surface Mount Technology (SMT) is used in the electronic industry to assemble and solder electronic components directly onto the surface of printed circuit boards. Unlike through-hole technology, where components have leads inserted into drilled holes, SMT components have small leads or no leads, relying on solder paste and a reflow soldering process to establish electrical connections.