Types of Thermal Compounds
Thermal compound is used to improve heat transfer between a computer processor and a heat sink. Below are its types and applications –
1. Metallic Based Pastes
- What They Are: Pastes containing metal particles such as silver or aluminum.
- Heat Transfer: Offer high thermal conductivity.
- Considerations: Electrically conductive, requiring careful application to prevent short circuits.
- Examples: Arctic Silver.
2. Ceramic Based Pastes
- What They Are: Composed of non-metallic ceramic particles like aluminum oxide.
- Heat Transfer: Provide good thermal conductivity, safer for electronics.
- Considerations: Preferred for general use where electrical risks are a concern.
- Examples: Arctic MX-4, Noctua NT-H1.
3. Silicone Based Pastes
- What They Are: Use silicone oil with conductive materials.
- Heat Transfer: Generally lower in thermal conductivity.
- Considerations: Useful for less demanding applications.
- Examples: Often found in generic brands and pre-applied on some cooling components.
4. Carbon Based Pastes
- What They Are: Contain carbon or diamond particles.
- Heat Transfer: High conductivity, comparable to metallic pastes.
- Considerations: Non-conductive and excellent for high-performance needs.
- Examples: Thermal Grizzly Kryonaut, Innovation Cooling Diamond.
5. Liquid Metal Compounds
- What They Are: Alloys like gallium-indium that are liquid at room temperature.
- Heat Transfer: Extremely high thermal conductivity.
- Considerations: Can be corrosive to some metals and require careful handling.
- Examples: Thermal Grizzly Conductonaut.
What is a Thermal Compound?
A thermal compound is a sticky paste that is applied directly to the CPU or another IC (integrated circuit) to provide more direct heat transfer between the chip and the heat sink. Thermal compound also keeps air gaps from accumulating between the CPU and the heat sink. This compound is a low-cost solution that may be purchased at any computer parts store.